Software Development and AI for Chip Package Board Codesign (w/m/div)

Infineon Technologies AG
Stellenbeschreibung
📍 Villach, Kärnten
💼 Vollzeit
💰 Nach Vereinbarung
📅 Veröffentlicht 30.5.2026

Stellenbeschreibung

Software Development and AI for Chip Package Board Codesign (w/m/div) Job Family Research & Development Type of employment Full time Duration of employment Permanent Preferred start date 2026-06-15 Join As Professional (incl. Management Positions) Is this position eligible for Hire4IFX? No WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problemsolvers behind tomorrow’s technology. Being responsible for Software Development and AI for Chip Package Board Codesign on…

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