Head of Consumer Electronics Packaging Engineering (Requires Relocation)

Shanghai BSF Human Resources Co., Ltd
Job description
📍 Singapore
💼 Full time
💰 1440 - 1800 SGD/year
📅 Posted 19/06/2026

Job description

Head of Consumer Electronics Packaging Engineering (Requires Relocation) We are seeking a highly qualified Package Process Engineering leader to join our dynamic team within the consumer electronics industry. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apples packaging products and processes. Responsibilities Research and Analysis : Conduct research on technology trends in the industry and competitors to form…

🚀 Apply now for free

Sign up to Kokobeo Jobs in 30 seconds.
AI-written CV, 1-click applications.

Sign up and apply →